Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process

• Main Authors: Mohd Noh, Mohd Syahrin Amri, Liew, David, Harun, Fuaida
• Format: Article
• Language: English; English
• Published: IEEE Conference Publications 2010
• Subjects: TS Manufactures
• Online Access: http://eprints.utem.edu.my/id/eprint/5199/1/Syahrin_IEMT_2010.pdf; http://eprints.utem.edu.my/id/eprint/5199/2/chipping_free_process.pdf; http://eprints.utem.edu.my/id/eprint/5199/; https://ieeexplore.ieee.org/document/5746667
• Institution: Universiti Teknikal Malaysia Melaka

Chipping free is a dream for wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metalliza...