UV/H2O2 oxidation process optimization by response surface methodology for removal of polycyclic aromatic hydrocarbons (PAHs) from water

由 Malakahmad, A., Ho, L.L.H.
出版 2017

State entrapment

由 Ho, H.L.
出版 2013

Comparative observations on the burden of proof for criminal defences

由 Ho, H.L.
出版 2013

Similar facts in civil cases

由 Ho, H.L.
出版 2013

What does a verdict do? A speech act analysis of giving a verdict

由 Ho, H.L.
出版 2013

Human prolactin

由 Cheah, J.S., Ho, C.L.
出版 2016

Analysis of repairable system failure data using time series models

由 Xie, M., Ho, S.L.
出版 2014

The use of ARIMA models for reliability forecasting and analysis

由 Ho, S.L., Xie, M.
出版 2014

Effects of ultrashort laser pulses on angular distributions of photoionization spectra

由 Raymond Ooi, C.H., Ho, W.L., Bandrauk, A.D.
出版 2017

High frequency plant regeneration from mature seed of elite, recalcitrant Malaysian indica rice (Oryza sativa l.) CV. MR 219

由 Sivakumar, P., Law, Y.S., Ho, C. L., Harikrishna, J.A.
出版 2010

Development of bio-health products from rice bran ferulates

由 Bagalkotkar, Gururaj, Ismail, Maznah, Ho, K. L., R., Nur Hazwani
出版 2008

Postoperative imaging of complications following cranial implants

由 Ho, C.L., McAdory, L.
出版 2021

Process monitoring strategies for surface mount manufacturing processes

由 Ho, S.-L., Xie, M., Goh, T.-N.
出版 2014

"Middling" Chinese Returnees or Immigrants from Canada? The Ambiguity of Return Migration and Claims to Modernity

由 Ho, E.L.-E., Ley, D.
出版 2016

Ocular surface status in glaucoma and ocular hypertension patients with existing corneal disorders switched from latanoprost 0.005% to tafluprost 0.0015%: comparison of two prostag...

由 Wong, T.T, Aung, T, Ho, C.L
出版 2020

Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration

由 Tay, A.A.O., Ho, S.L.
出版 2014

Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages

由 Ho, S.L., Tay, A.A.O.
出版 2014

3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages

由 Ho, S.L., Tay, A.A.O.
出版 2014

A numerical analysis of penny-shaped delaminations in an encapsulated silicon module

由 Ho, S.L., Tay, A.A.O.
出版 2014

A numerical study of 3D interfacial delamination in PQFP packages

由 Ho, S.L., Tay, A.A.O.
出版 2014