A study on lead free SnAgCu solder system

by Hoh, H.J., Eu, P.L., Ding, M., Ahmad, I.
Published 2017

Lead-free flux effect in lead-free solder joint improvement

by Eu, P.L., Ding, M., Ahmad, I., Hoh, H.J., Hazlinda, K.
Published 2017

Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance

by Eu, P.L., Ding, M., Hoh, H.J., Ahmad, I., Hazlinda, K.
Published 2017

A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish

by Eu, P.-L., Ding, M., Hoh, H.-J., Rayos, J., Su, P., Lindsay, W., Chopin, S., Ahmad, I.
Published 2017