Investigation into chemistry and performance of no-clean flux in fine pitch flip-chip package

by Wakeel, Saif, Haseeb, A. S. Md. Abdul, Amalina, Muhammad Afifi, Hoon, Khoo Ly
Published 2022

Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars

by Wakeel, Saif, Haseeb, A. S. Md. Abdul, Hoon, Khoo Ly, Amalina, Muhammad Afifi
Published 2022

Constituents and performance of no-clean flux for electronic solder

by Wakeel, Saif, Abdul Haseeb, A. S. Md., Muhammad Afifi, Amalina, Bingol, Sedat, Hoon, Khoo Ly
Published 2021