Comparison between ANSYS and CATIA simulation capability in simulating round shape diaphragm of MEMS piezoresistive pressure sensor

by Zaiazmin, Y. N., Ishak, Abdul Azid
Published 2009

Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms

by Jeevan, Kanesan, Ghulam, Abdul Quadir, Prof. Dr., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr.
Published 2014

Optimization of PCB component placement using genetic algorithm

by Jeevan, Kanesan, Parthiban, A., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014

Application of artificial neural network for fatigue life prediction

by Ishak, Abdul Azid, Dr., Lee, Kor Oon, Ong, Kang E., Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014

Optimization of thermal resistance of stacked micro-channel using genetic algorithms

by Jeevan, Kanesan, Ghulam, Quadir, Prof. Dr., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Published 2014

Numerical simulation of underfill encapsulation process based on characteritsic split method

by Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Aswatha Narayana, P. A., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014

Flow analysis for flip chip underfilling process using characteristic based split method

by Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Aswatha Narayana, P. A., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014

Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life

by Lee, Kor Oon, Ong, Kang E., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr., Goh, Teck Joo
Published 2014

Optimization of liquid cooling fins in microelectronic packaging

by Ng, N. T., Lai, K. W., Ghulam, Quadir, Prof. Dr., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Published 2014

Optimization of fins used in electronic packaging

by Ong, Kang Eu, Lee, Kor Oon, Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Goh, Teck Joo
Published 2014