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Lim, Ju Dy
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Lim, Ju Dy
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Lim, Ju Dy
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Improving adhesion of copper thin films of alumina substrate through interface engineering
by
Lim
,
Ju
Dy
Published 2016
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2
Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate
by
Lim
,
Ju
Dy
,
Lee, Pui Mun
,
Chen, Zhong
Published 2017
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3
Surface roughness effect on copper–alumina adhesion
by
Lim
,
Ju
Dy
,
Yeow, Su Yi Susan
,
Rhee, MinWoo Daniel
,
Leong, Kam Chew
,
Wong, Chee Cheong
Published 2016
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