Surface roughness effect on copper–alumina adhesion

• المؤلفون الرئيسيون: Lim, Ju Dy, Yeow, Su Yi Susan, Rhee, MinWoo Daniel, Leong, Kam Chew, Wong, Chee Cheong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2016
• الموضوعات: Surface area; Surface roughness; Copper; Bonding strength; Alumina
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/81601; http://hdl.handle.net/10220/39596
• المؤسسة: Nanyang Technological University

The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With roughe...