Surface roughness effect on copper–alumina adhesion

Surface roughness effect on copper–alumina adhesion

The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With roughe...

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Bibliographic Details
Main Authors: Lim, Ju Dy, Yeow, Su Yi Susan, Rhee, MinWoo Daniel, Leong, Kam Chew, Wong, Chee Cheong
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2016
Subjects:
Surface area
Surface roughness
Copper
Bonding strength
Alumina
Online Access:https://hdl.handle.net/10356/81601
http://hdl.handle.net/10220/39596
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Institution: Nanyang Technological University
Language: English
Description
Summary:The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper–96% pure alumina, this effect can account for an adhesive strength increment of more than 50%.

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