Surface roughness effect on copper–alumina adhesion
The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With roughe...
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sg-ntu-dr.10356-816012023-07-14T15:50:32Z Surface roughness effect on copper–alumina adhesion Lim, Ju Dy Yeow, Su Yi Susan Rhee, MinWoo Daniel Leong, Kam Chew Wong, Chee Cheong School of Materials Science & Engineering Surface area Surface roughness Copper Bonding strength Alumina The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper–96% pure alumina, this effect can account for an adhesive strength increment of more than 50%. ASTAR (Agency for Sci., Tech. and Research, S’pore) Accepted version 2016-01-06T07:20:01Z 2019-12-06T14:34:44Z 2016-01-06T07:20:01Z 2019-12-06T14:34:44Z 2013 Journal Article Lim, J. D., Yeow, S. Y. S., Rhee, M. D., Leong, K. C., & Wong, C. C. (2013). Surface roughness effect on copper–alumina adhesion. Microelectronics Reliability, 53(9-11), 1548-1552. 0026-2714 https://hdl.handle.net/10356/81601 http://hdl.handle.net/10220/39596 10.1016/j.microrel.2013.07.016 en Microelectronics Reliability © 2013 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2013.07.016]. 8 p. application/pdf |
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Surface area Surface roughness Copper Bonding strength Alumina |
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Surface area Surface roughness Copper Bonding strength Alumina Lim, Ju Dy Yeow, Su Yi Susan Rhee, MinWoo Daniel Leong, Kam Chew Wong, Chee Cheong Surface roughness effect on copper–alumina adhesion |
| description |
The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper–96% pure alumina, this effect can account for an adhesive strength increment of more than 50%. |
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School of Materials Science & Engineering |
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School of Materials Science & Engineering Lim, Ju Dy Yeow, Su Yi Susan Rhee, MinWoo Daniel Leong, Kam Chew Wong, Chee Cheong |
| format |
Article |
| author |
Lim, Ju Dy Yeow, Su Yi Susan Rhee, MinWoo Daniel Leong, Kam Chew Wong, Chee Cheong |
| author_sort |
Lim, Ju Dy |
| title |
Surface roughness effect on copper–alumina adhesion |
| title_short |
Surface roughness effect on copper–alumina adhesion |
| title_full |
Surface roughness effect on copper–alumina adhesion |
| title_fullStr |
Surface roughness effect on copper–alumina adhesion |
| title_full_unstemmed |
Surface roughness effect on copper–alumina adhesion |
| title_sort |
surface roughness effect on copper–alumina adhesion |
| publishDate |
2016 |
| url |
https://hdl.handle.net/10356/81601 http://hdl.handle.net/10220/39596 |
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1772828741479694336 |