Surface roughness effect on copper–alumina adhesion

The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With roughe...

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Main Authors: Lim, Ju Dy, Yeow, Su Yi Susan, Rhee, MinWoo Daniel, Leong, Kam Chew, Wong, Chee Cheong
其他作者: School of Materials Science & Engineering
格式: Article
語言:English
出版: 2016
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在線閱讀:https://hdl.handle.net/10356/81601
http://hdl.handle.net/10220/39596
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機構: Nanyang Technological University
語言: English

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