Surface roughness effect on copper–alumina adhesion
The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With roughe...
Saved in:
Main Authors: | Lim, Ju Dy, Yeow, Su Yi Susan, Rhee, MinWoo Daniel, Leong, Kam Chew, Wong, Chee Cheong |
---|---|
其他作者: | School of Materials Science & Engineering |
格式: | Article |
語言: | English |
出版: |
2016
|
主題: | |
在線閱讀: | https://hdl.handle.net/10356/81601 http://hdl.handle.net/10220/39596 |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
機構: | Nanyang Technological University |
語言: | English |
相似書籍
-
Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate
由: Lim, Ju Dy, et al.
出版: (2017) -
Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
由: Wu, S., et al.
出版: (2014) -
The effect of digestion on the surface area and porosity of alumina
由: Chuah, G.K., et al.
出版: (2014) -
Wavelet analysis and interpretation of road roughness
由: Liu, W., et al.
出版: (2014) -
The variation of ice adhesion strength with substrate surface roughness
由: Hassan, M.F., et al.
出版: (2014)