Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization

IEEE Transactions on Advanced Packaging

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Bibliographic Details
Main Authors: Wu, S., Kang, E.T., Neoh, K.G., Cui, C.Q., Lim, T.B.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91859
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Institution: National University of Singapore