Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization

IEEE Transactions on Advanced Packaging

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Main Authors:	Wu, S., Kang, E.T., Neoh, K.G., Cui, C.Q., Lim, T.B.
Other Authors:	CHEMICAL & ENVIRONMENTAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Copper Double graft copolymerization Peel strength PTFE Reliability Surface modification
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/91859
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-91859
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spelling	sg-nus-scholar.10635-918592024-11-11T07:28:01Z Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization Wu, S. Kang, E.T. Neoh, K.G. Cui, C.Q. Lim, T.B. CHEMICAL & ENVIRONMENTAL ENGINEERING Copper Double graft copolymerization Peel strength PTFE Reliability Surface modification IEEE Transactions on Advanced Packaging 23 3 538-545 ITAPF 2014-10-09T09:51:31Z 2014-10-09T09:51:31Z 2000 Article Wu, S.,Kang, E.T.,Neoh, K.G.,Cui, C.Q.,Lim, T.B. (2000). Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization. IEEE Transactions on Advanced Packaging 23 (3) : 538-545. ScholarBank@NUS Repository. 15213323 http://scholarbank.nus.edu.sg/handle/10635/91859 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Copper Double graft copolymerization Peel strength PTFE Reliability Surface modification
spellingShingle	Copper Double graft copolymerization Peel strength PTFE Reliability Surface modification Wu, S. Kang, E.T. Neoh, K.G. Cui, C.Q. Lim, T.B. Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
description	IEEE Transactions on Advanced Packaging
author2	CHEMICAL & ENVIRONMENTAL ENGINEERING
author_facet	CHEMICAL & ENVIRONMENTAL ENGINEERING Wu, S. Kang, E.T. Neoh, K.G. Cui, C.Q. Lim, T.B.
format	Article
author	Wu, S. Kang, E.T. Neoh, K.G. Cui, C.Q. Lim, T.B.
author_sort	Wu, S.
title	Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
title_short	Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
title_full	Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
title_fullStr	Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
title_full_unstemmed	Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
title_sort	adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/91859
_version_	1821208888114937856

Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization

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