Modeling of electromigration failure under pulsed current conditions in confined copper interconnect

by Lin, Jingyuan.
Published 2010

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

by Lim, Meng Keong, Lin, Jingyuan, Ee, Elden Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
Published 2013