Plasma assisted deposition of Ti-Si-N and Ti-Si-N-O diffusion barrier films

by Ee, Elden Yong Chiang
Published 2010

Electroless copper seed layer deposition on tantalum nitride barrier film

by Chong, S. P., Law, S. B., Ee, Elden Yong Chiang, Chen, Zhong
Published 2012

Low temperature physical-chemical vapor deposition of Ti-Si-N-O barrier films

by Lu, T. M., Law, S. B., Chen, Z., Ee, Elden Yong Chiang, Dong, Zhili
Published 2012

Electroless copper deposition as a seed layer on TiSiN barrier

by Chen, Z., Xu, S., Chan, L., See, K. H., Law, S. B., Ee, Elden Yong Chiang
Published 2012

Barrier property of TiSiN films formed by low frequency, high density inductively coupled plasma process

by Chen, Z., Wang, W. D., Xu, S., Law, S. B., Ee, Elden Yong Chiang, Chi, Dong Zhi
Published 2012

Copper diffusion in Ti–Si–N layers formed by inductively coupled plasma implantation

by Xu, S., Lai, M. Y., Yakovlev, N. L., Law, S. B., Chen, Z., Ee, Elden Yong Chiang
Published 2012

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

by Lim, Meng Keong, Lin, Jingyuan, Ee, Elden Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
Published 2013

Effect of processing parameters on electroless Cu seed layer properties

by Chen, Z., Chan, L., See, Alex K. H., Law, S. B., Zeng, K. Y., Shen, L., Tee, K. C., Ee, Elden Yong Chiang
Published 2012

Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process

by Rutkevych, P. P., Zeng, K. Y., Chen, Z., Chan, L., See, K. H., Law, S. B., Xu, S., Tsakadze, Z. L., Shen, L., Ee, Elden Yong Chiang
Published 2012