Plasma assisted deposition of Ti-Si-N and Ti-Si-N-O diffusion barrier films

بواسطة Ee, Elden Yong Chiang
منشور في 2010

Electroless copper seed layer deposition on tantalum nitride barrier film

بواسطة Chong, S. P., Law, S. B., Ee, Elden Yong Chiang, Chen, Zhong
منشور في 2012

Low temperature physical-chemical vapor deposition of Ti-Si-N-O barrier films

بواسطة Lu, T. M., Law, S. B., Chen, Z., Ee, Elden Yong Chiang, Dong, Zhili
منشور في 2012

Electroless copper deposition as a seed layer on TiSiN barrier

بواسطة Chen, Z., Xu, S., Chan, L., See, K. H., Law, S. B., Ee, Elden Yong Chiang
منشور في 2012

Barrier property of TiSiN films formed by low frequency, high density inductively coupled plasma process

بواسطة Chen, Z., Wang, W. D., Xu, S., Law, S. B., Ee, Elden Yong Chiang, Chi, Dong Zhi
منشور في 2012

Copper diffusion in Ti–Si–N layers formed by inductively coupled plasma implantation

بواسطة Xu, S., Lai, M. Y., Yakovlev, N. L., Law, S. B., Chen, Z., Ee, Elden Yong Chiang
منشور في 2012

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

بواسطة Lim, Meng Keong, Lin, Jingyuan, Ee, Elden Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
منشور في 2013

Effect of processing parameters on electroless Cu seed layer properties

بواسطة Chen, Z., Chan, L., See, Alex K. H., Law, S. B., Zeng, K. Y., Shen, L., Tee, K. C., Ee, Elden Yong Chiang
منشور في 2012

Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process

بواسطة Rutkevych, P. P., Zeng, K. Y., Chen, Z., Chan, L., See, K. H., Law, S. B., Xu, S., Tsakadze, Z. L., Shen, L., Ee, Elden Yong Chiang
منشور في 2012