Modeling of electromigration failure under pulsed current conditions in confined copper interconnect

由 Lin, Jingyuan.
出版 2010

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

由 Lim, Meng Keong, Lin, Jingyuan, Ee, Elden Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
出版 2013