Thermal-aware electrical analysis of high-speed interconnect

by Liu, E.-X., Li, E.-P., Wei, X.
Published 2014

An efficient equivalent circuit model for the EMC analysis of power/ground noise

by Wei, X.C., Li, E.P., Liu, E.X.
Published 2014

Extraction of circuit parameters for transmission lines by compact 2D FDFD method

by Liu, E.-X., Li, E.-P., Li, L.-W.
Published 2014

A novel integrated approach for simulation of electromagnetic susceptibility problem

by Jin, H.-F., Li, E.-P., Liu, E.-X.
Published 2014

Analysis of multilayer planar circuits by a hybrid method

by Liu, E.-X., Li, E.-P., Li, L.-W.
Published 2014

Analysis of signal propagation on high-speed planar interconnect systems based on full-wave and macromodeling techniques

by Liu, E.-X., Li, E.-P., Li, L.-W.
Published 2014

Hybrid FDTD-MPIE method for the simulation of locally inhomogeneous multilayer LTCC structure

by Liu, E.-X., Li, E.-P., Li, L.-W.
Published 2014

A 2D time domain method for electrical analysis of electronic packages

by Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P.
Published 2014

An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages

by Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P.
Published 2014

Impact of TSV induced thermo-mechanical stress on semiconductor device performance

by Lee, H.M., Liu, E.-X., Samudra, G.S., Li, E.-P.
Published 2014

A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects

by Li, E.-P., Liu, E.-X., Li, L.-W., Leong, M.-S.
Published 2014

Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation

by Wei, X.-C., Li, E.-P., Liu, E.-X., Cui, X.
Published 2014

An efficient method for power integrity and EMI analysis of advanced packages

by Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P.
Published 2014

Finite-difference time-domain macromodel for simulation of electromagnetic interference at high-speed interconnects

by Liu, E.-X., Li, E.-P., Li, L.-W., Shen, Z.
Published 2014

Modeling of advanced multilayered packages with multiple vias and finite ground planes

by Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P., Li, L.-W.
Published 2014

Computing the RCS of dielectric coated objects using multilevel fast multipole algrithm: Impedance boudary condition approach

by Oo, Z.Z., Liu, E.-X., Li, E.-P., Zhang, Y.J., Li, L.-W.
Published 2014

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

by Oo, Z.Z., Wei, X.-C., Liu, E.-X., Li, E.-P., Li, L.-W.
Published 2014

A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages

by Li, E.-P., Liu, E.-X., Oo, Z.Z., Wei, X., Zhang, Y., Vahldieck, R.
Published 2014

Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method

by Wei, X.-C., Li, E.-P., Liu, E.-X., Chua, E.-K., Oo, Z.-Z., Vahldieck, R.
Published 2014

Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias

by Oo, Z.Z., Liu, E.-X., Wei, X., Choon, M.T.Y., Li, E.-P., Zhang, Y., Li, L.-W.
Published 2014