Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

by M.A., Rabiatul Adawiyah, O., Saliza Azlina
Published 2018

Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper

by M.A., Rabiatul Adawiyah, O., Saliza Azlina
Published 2017

Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate

by M.A., Rabiatul Adawiyah, S.A., Amirul, O., Saliza Azlina, H., Syafiq
Published 2020

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg

by M.A., Rabiatul Adawiyah, A.B., M. Hafiz, O., Saliza Azlina, J., Zolhafizi, W.M., Wan Nur Azrina, O., Shahrul Azmir
Published 2019