Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as an alternative to lead-free surface finish in electronic industry for the reduction of metal cost without affecting the reliability and solderability performance. In this study, different types of lead-free sold...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
ScienceDirect
2018
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/5599/1/AJ%202018%20%28262%29.pdf http://eprints.uthm.edu.my/5599/ |
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| Institution: | Universiti Tun Hussein Onn Malaysia |
| Language: | English |