Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as an alternative to lead-free surface finish in electronic industry for the reduction of metal cost without affecting the reliability and solderability performance. In this study, different types of lead-free sold...
Saved in:
| Main Authors: | , |
|---|---|
| 格式: | Article |
| 語言: | English |
| 出版: |
ScienceDirect
2018
|
| 主題: | |
| 在線閱讀: | http://eprints.uthm.edu.my/5599/1/AJ%202018%20%28262%29.pdf http://eprints.uthm.edu.my/5599/ |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | Universiti Tun Hussein Onn Malaysia |
| 語言: | English |