Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

• Main Authors: M.A., Rabiatul Adawiyah, O., Saliza Azlina
• Format: Article
• Language: English
• Published: ScienceDirect 2018
• Subjects: T Technology (General); TA401-492 Materials of engineering and construction. Mechanics of materials
• Online Access: http://eprints.uthm.edu.my/5599/1/AJ%202018%20%28262%29.pdf; http://eprints.uthm.edu.my/5599/
• Institution: Universiti Tun Hussein Onn Malaysia

The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as an alternative to lead-free surface finish in electronic industry for the reduction of metal cost without affecting the reliability and solderability performance. In this study, different types of lead-free sold...