Small area X-ray photoelectron spectroscopy (SAXPS) analysis of microscopic contamination in semiconductor materials and processes

by Marks, M.R., Kintrup, L., Bittigau, K.
Published 2014

An experimental study of die attach polymer bleedout in ceramic packages

by Marks, M.R., Thompson, J.A., Gopalakrishnan, R.
Published 2014

A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging

by Marks, M.R., Wei, Q., Jiaji, W., Yi, C.
Published 2014