An experimental study of die attach polymer bleedout in ceramic packages

Thin Solid Films

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Bibliographic Details
Main Authors: Marks, M.R., Thompson, J.A., Gopalakrishnan, R.
Other Authors: PHYSICS
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/112960
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Institution: National University of Singapore