An experimental study of die attach polymer bleedout in ceramic packages

An experimental study of die attach polymer bleedout in ceramic packages

Thin Solid Films

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Bibliographic Details
Main Authors: Marks, M.R., Thompson, J.A., Gopalakrishnan, R.
Other Authors: PHYSICS
Format: Article
Published: 2014
Subjects:
Gold
Nickel oxide
Polymers
Surface energy
Online Access:http://scholarbank.nus.edu.sg/handle/10635/112960
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-1129602015-01-14T18:07:13Z An experimental study of die attach polymer bleedout in ceramic packages Marks, M.R. Thompson, J.A. Gopalakrishnan, R. PHYSICS INSTITUTE OF MICROELECTRONICS Gold Nickel oxide Polymers Surface energy Thin Solid Films 252 1 54-60 THSFA 2014-11-28T08:12:43Z 2014-11-28T08:12:43Z 1994-11-15 Article Marks, M.R.,Thompson, J.A.,Gopalakrishnan, R. (1994-11-15). An experimental study of die attach polymer bleedout in ceramic packages. Thin Solid Films 252 (1) : 54-60. ScholarBank@NUS Repository. 00406090 http://scholarbank.nus.edu.sg/handle/10635/112960 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic Gold
Nickel oxide
Polymers
Surface energy
spellingShingle Gold
Nickel oxide
Polymers
Surface energy
Marks, M.R.
Thompson, J.A.
Gopalakrishnan, R.
An experimental study of die attach polymer bleedout in ceramic packages
description Thin Solid Films
author2 PHYSICS
author_facet PHYSICS
Marks, M.R.
Thompson, J.A.
Gopalakrishnan, R.
format Article
author Marks, M.R.
Thompson, J.A.
Gopalakrishnan, R.
author_sort Marks, M.R.
title An experimental study of die attach polymer bleedout in ceramic packages
title_short An experimental study of die attach polymer bleedout in ceramic packages
title_full An experimental study of die attach polymer bleedout in ceramic packages
title_fullStr An experimental study of die attach polymer bleedout in ceramic packages
title_full_unstemmed An experimental study of die attach polymer bleedout in ceramic packages
title_sort experimental study of die attach polymer bleedout in ceramic packages
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/112960
_version_ 1681094578164203520

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