Evaluation of machine learning classifiers in faulty die prediction to maximize cost scrapping avoidance and assembly test capacity savings in semiconductor integrated circuit (IC)...

by Mohd Fazil, Azlan Faizal, Mohd Shaharanee, Izwan Nizal, Mohd Jamil, Jastini
Published 2019

Framework to reduce cost scrapping and cost of assemble test capacity in semiconductor integrated circuit manufacturing

by Mohd Fazil, Azlan Faizal, Mohd Shaharanee, Izwan Nizal, Mohd Jamil, Jastini, Ang, Jin Sheng
Published 2020