Framework to reduce cost scrapping and cost of assemble test capacity in semiconductor integrated circuit manufacturing

Framework to reduce cost scrapping and cost of assemble test capacity in semiconductor integrated circuit manufacturing

Semiconductor including integrated circuit (IC) is an expensive and complicated process. The trend of semiconductor packaging is going towards better performance with lower power consumption packages. Thus, the single-die packaging trend has evolved into multi-die packaging. The evolution of multi-...

Full description

Saved in:
Bibliographic Details
Main Authors: Mohd Fazil, Azlan Faizal, Mohd Shaharanee, Izwan Nizal, Mohd Jamil, Jastini, Ang, Jin Sheng
Format: Article
Language:English
Published: kansai university, japan 2020
Subjects:
QA75 Electronic computers. Computer science
Online Access:http://repo.uum.edu.my/28159/1/TRKU%2062%2017%202020%203625%203630.pdf
http://repo.uum.edu.my/28159/
https://www.kansaiuniversityreports.com/search-article
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Utara Malaysia
Language: English

Internet

http://repo.uum.edu.my/28159/1/TRKU%2062%2017%202020%203625%203630.pdf
http://repo.uum.edu.my/28159/
https://www.kansaiuniversityreports.com/search-article

Similar Items