Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes

by Osman, Saliza Azlina
Published 2012

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish

by Osman, Saliza Azlina
Published 2008

Study on interfacial reaction between lead-free solders and alternative surface finishes

by Idris, Siti rabiatull aisha, Ourdjini, A., Osman, Saliza
Published 2007

Effect of nickel doping on interfacial reaction between lead-free solder and ni-p substrate

by Osman, Saliza Azlina, Ourdjini, Ali, Idris, Siti Rabiatull Aisha
Published 2012

The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish

by Osman, Saliza Azlina, Ourdjini, Ali, Mohamed Ariff, Azmah Hanim
Published 2014

Effect of isothermal aging 2000 hours on intermetallics formed between ni-pd-au with sn-4ag-0.5cu solders

by Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina
Published 2013

Effect of reflow profile on intermetallic compound formation

by Idris, Siti Rabiatull Aisha, Ourdjini, Ali, Mohamed Ariff, Azmah Hanim, Osman, Saliza Azlina
Published 2013

Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders

by Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina
Published 2013

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes

by Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina
Published 2015

Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging

by Mat Hussin, Nur Liyana, Mohamed Ariff, Azmah Hanim, Sulaiman, Shamsuddin, Osman, Saliza Azlina
Published 2015

Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish

by Mohamed Anuar, Rabiatul Adawiyah, Hamidin, Mohamad Shahrom, Osman, Saliza Azlina, Othman, Mohamad Hilmi
Published 2020

Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process

by Fauzi, Muhamad Razizy, Amiruddin, Nurul Amira, Osman, Saliza Azlina, Mohamed Anuar, Rabiatul Adawiyah
Published 2022

Shear analysis of rice husk ash RHA reinforced tin- 0.7-copper composite solders on electroless nickel/immersion silver ENIAg surfaces

by Mohamed Ariff, Azmah Hanim, Chuan, Khang Wei, Temitope T., Dele-Afolabi, Osman, Saliza Azlina
Published 2021

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish

by Mohamed Ariff, Azmah Hanim, N., Muhamad Kamil, Wei, Chuan Khang, Temitope T., Dele-Afolabi, Osman, Saliza Azlina
Published 2020

Effect of etching as pre-treatment for electroless copper plating on silicon wafer

by Mior Shahidina, Shazatul Akmaliah, Fadila, Nor Akmal, Yusopa, Mohd Zamri, Tamina, Mohd Nasir, Osman, Saliza Azlina
Published 2017

Tin whiskers’ behavior under stress load and the mitigation method for immersion tin surface finish

by Fadil, Nor Akmal, Yusof, Siti Zahira, Abu Bakar, Tuty Asma, Ghazali, Habibah, Mat Yajid, Muhamad Azizi, Osman, Saliza Azlina, Ourdjini, Ali
Published 2021