Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

by Kar Y.B., Talik N.A., Sauli Z., Fei J.S., Retnasamy V.
Published 2023

Electrical testing for MEMS's piezoresistive pressure sensor

by Abd Wahab, M.Z.B., Sauli, Z.B., Ahmad, I., Suradi, W.B.
Published 2017

Digital fringe projection system for round shaped breast tumor detection

by Norhaimi, W. M. W., Sauli, Z., Aris, H., Retnasamy, V., Vairavan, R., Aziz, M. H. A
Published 2020

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

by Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.
Published 2023