Technical barriers and development of Cu wirebonding in nanoelectronics device packaging

by C., L. Gan, E., K. Ng, B., L. Chan, Uda, Hashim, Prof. Dr., F., C. Classe
Published 2013

Influence of shear strength on long term biased humidity reliability of Cu ball bonds

by Chong, Leong Gan, Uda, Hashim, Prof. Dr.
Published 2015

Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging

by Gan, Chong Leong, Uda, Hashim, Prof. Dr.
Published 2014

Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging

by Chong, Leong Gan, E., K. Ng, Bak, Lee Chan, Classe, Francis, Kwuanjai, T., Uda, Hashim, Prof. Dr.
Published 2014