Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

by Siti Rahmah, Esa, Genesia, Omar, Siti Hajar, Sheikh Md Fadzullah, Kim, S. Siow, B. Abdul Rahim, B. Çoşut
Published 2020

The effect of temperature on the electrical conductivity and microstructure behaviour of silver particles

by A. M., Yunos, G., Omar, M. A, Salim, N. A., Masripan, Mohammed Hussin Ahmed Al-Mola
Published 2020

Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

by A. S., Ashikin, G., Omar, N., Tamaldin, S., Jasmee, H. A., Hamid, A., Jalar, F., Che Ani
Published 2020

The evolutions of microstructure in pressureless Sintered Silver die attach material

by S.R., Esa, G., Omar, S.H. Sheikh, Md Fadzullah, K.S Siow, B., Abdul Rahim
Published 2021