Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

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Bibliographic Details
Main Authors: A. S., Ashikin, G., Omar, N., Tamaldin, S., Jasmee, H. A., Hamid, A., Jalar, F., Che Ani
Other Authors: ghazali@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2020
Subjects:
Stretchable silver conductive ink
Thermal
Wettability
Surface roughness
Sheet resistance
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823

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