Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

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Bibliographic Details
Main Authors:	A. S., Ashikin, G., Omar, N., Tamaldin, S., Jasmee, H. A., Hamid, A., Jalar, F., Che Ani
Other Authors:	ghazali@utem.edu.my
Format:	Article
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2020
Subjects:	Stretchable silver conductive ink Thermal Wettability Surface roughness Sheet resistance
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823
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Institution:	Universiti Malaysia Perlis
Language:	English

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