Wire bond shear test simulation on sharp groove surface bond pad

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Taniselass, Steven, Ahmad Husni, Mohd Shapri, Vairavan, Rajendaran
Published 2014

CuDia slug size variation analysis on heat dissipation of high power LED

by Vairavan, Rajendaran, Retnasamy, Vithyacharan, Zaliman, Sauli, Dr.
Published 2014

Numerical analysis of velocity profile in a FFS microchannel

by Nor Shakirina, Nadzri, Retnasamy, Vithyacharan, Zaliman, Sauli, Dr., Tan, Hsio Mei, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Published 2014

Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous

by Retnasamy, Vithyacharan, Zaliman, Sauli, Dr., Aaron, Koay Terr Yeow, Goh, Siew Chui, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Published 2014