ANALYSIS EFFECT OF BONDING ON OVERLAY DESIGN USING AUSTROADS METHOD (CASE STUDY : JATIBARANG â PALIMANAN ROADS)
Pavement damage condition can be caused by several factors, one of this factor is full bonding assumption between interface layer. This condition is rarely happens in the field. Many factors that caused this condition, one of that is tack coat work. The effect of condition is damage between pavem...
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Format: | Theses |
Language: | Indonesia |
Subjects: | |
Online Access: | https://digilib.itb.ac.id/gdl/view/32132 |
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Institution: | Institut Teknologi Bandung |
Language: | Indonesia |
Summary: | Pavement damage condition can be caused by several factors, one of this factor is
full bonding assumption between interface layer. This condition is rarely happens
in the field. Many factors that caused this condition, one of that is tack coat work.
The effect of condition is damage between pavement layers. One of the types of
damage caused by conditions not full bonding on pavement structure between aspha
lt wearing course (asphalt overlay) with existing layer is slippage cracking. The
purpose of this study is analysis of bonding condition on overlay design using
AUSTROADS 2011 method.
Overlay design using FWD (Falling Weight Deflectometer) displacement data as
input on AUSTROADS 2011. Backcalculation process has been determine for
layer moduli value using ELMOD program. Traffic data are used to find the value
of load design in AUSTROADS 2011 method with two criteria damage are fatigue
criteria (DSAR5) and permanent deformation criteria (DSAR7).
The results of theoretical study have shown that between AC overlay exsiting and
surface layer highly sensitive to bonding variation condition, beside that the location
of critical strain for fatigue criteria is under tire (axis = 0.1575) and between tire
(axis = 0) for permanent deformation criteria. The results of design overlay based
on 3 layer and 4 layer modeling showed that 3 layer modelling generate the thinner
overlay design, that is when full bonding condition is ± 10 mm, intermediate
bonding is ± 10 mm and no bonding is ± 20-50 mm while the 4-layer modeling that
is when full bonding condition is ± 10 – 20 mm, intermediate bonding ± 20 mm and
no bonding is ± 50 mm.
Based on overlay design by considering bonding condition can be concluded that
analysis using partial bonding had to overlay thickness which thicker than full
bonding condition. |
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