ANALYSIS EFFECT OF BONDING ON OVERLAY DESIGN USING AUSTROADS METHOD (CASE STUDY : JATIBARANG – PALIMANAN ROADS)

• Main Author: Aisyah, Linda
• Format: Theses
• Language: Indonesia
• Subjects: Teknik jalan kereta api dan jalan raya
• Online Access: https://digilib.itb.ac.id/gdl/view/32132
• Institution: Institut Teknologi Bandung

Pavement damage condition can be caused by several factors, one of this factor is full bonding assumption between interface layer. This condition is rarely happens in the field. Many factors that caused this condition, one of that is tack coat work. The effect of condition is damage between pavement layers. One of the types of damage caused by conditions not full bonding on pavement structure between aspha lt wearing course (asphalt overlay) with existing layer is slippage cracking. The purpose of this study is analysis of bonding condition on overlay design using AUSTROADS 2011 method. Overlay design using FWD (Falling Weight Deflectometer) displacement data as input on AUSTROADS 2011. Backcalculation process has been determine for layer moduli value using ELMOD program. Traffic data are used to find the value of load design in AUSTROADS 2011 method with two criteria damage are fatigue criteria (DSAR5) and permanent deformation criteria (DSAR7). The results of theoretical study have shown that between AC overlay exsiting and surface layer highly sensitive to bonding variation condition, beside that the location of critical strain for fatigue criteria is under tire (axis = 0.1575) and between tire (axis = 0) for permanent deformation criteria. The results of design overlay based on 3 layer and 4 layer modeling showed that 3 layer modelling generate the thinner overlay design, that is when full bonding condition is ± 10 mm, intermediate bonding is ± 10 mm and no bonding is ± 20-50 mm while the 4-layer modeling that is when full bonding condition is ± 10 – 20 mm, intermediate bonding ± 20 mm and no bonding is ± 50 mm. Based on overlay design by considering bonding condition can be concluded that analysis using partial bonding had to overlay thickness which thicker than full bonding condition.