DESIGN AND IMPLEMENTATION OF STRUCTURAL PARTS IN THE AUTOMATIC WAFER CLEANING SYSTEM

• Main Author: Garumby, Nenda
• Format: Final Project
• Language: Indonesia
• Online Access: https://digilib.itb.ac.id/gdl/view/41688
• Institution: Institut Teknologi Bandung

In the research of the semiconductor field, the process of preparing samples from semiconductor wafers has a failure rate quite high. The two main causes are photolithographic errors and errors in wafer cleaning processes. Wafer cleaning is an important part of the research process of objects using semiconductor materials. At present, most of the cleaning of wafers is still done manually. This has several disadvantages that can make the research process less than optimal. The automatic wafer cleaning system that will be developed as a function as a substitute for the role of humans in the process of cleaning semiconductor wafers. The cleaning process includes spraying chemical liquids and water automatically, spinning wafers, and automatic drying. In this final project will be discussed about the structural parts of the automatic wafer cleaning system. The structural part of this tool consists of three main systems namely the spinning system, the drive system, and chemical fluid management. In the spinning system, the cleaned wafer will be rotated by a DC motor integrated with the gear circuit. At the same time, the wafer is sucked by the vacuum machine so that the wafer stays in position when it is played with the wafer chuck. The drive system is a system that regulates the direction of spraying leaching chemical liquid on the wafer. This system utilizes the rotation of the Stepper Motor which is integrated into the spray regulator circuit to direct the nozzle right on the wafer surface. Whereas chemical liquid management functions to regulate the running of washing liquid from the initial spraying to the disposal. In its implementation, component selection and design determination of each system greatly influence the success of the wafer washing process such as the accuracy of spraying, material resistance and the amount of liquid used.