DESIGN AND IMPLEMENTATION OF SPINNER AND SPRAYER ARM CONTROL SYSTEM OF THE AUTOMATIC WAFER CLEANING SYSTEM

• Main Author: Fithratur Rahman, Muhammad
• Format: Final Project
• Language: Indonesia
• Online Access: https://digilib.itb.ac.id/gdl/view/41739
• Institution: Institut Teknologi Bandung

The semiconductor wafer cleaning process is one of the important parts in microelectronics industry. In the process of chip or IC fabrication, the substrate which is a silicon semiconductor wafer has to be in a clean condition before entering the next stages such as oxidation, thin-film layering, lithography, etc. A contaminated wafer could make a defect in the product that will cause a decrease in quality or even leave it unable to be used. The process of chip production in the industry is purposed for large scale manufacture, compared to small laboratory scale that is meant for research purpose. This leaves the manual cleaning process in the laboratory to still be used for wafer cleaning. The manual cleaning process needs a relatively long time (>2 hours) with many transferring processes done by the researcher. The method causes many cases of contamination and failure to transfer the wafer that causes the process of cleaning failed. This final project develops the automatic wafer cleaning system based on RCA cleaning for laboratory scale using spinning and spraying method where a wafer will be placed and spun on a vacuum chuck and get sprayed by chemical solutions in some order for one side wafer cleaning, that makes the spinner and sprayer system as a vital of the machine. This book will contain the design and implementation of the spinner and sprayer control system along with the other important part of the automatic wafer cleaning system, the circuit and the power circuit. The design and implementation are meant to accommodate the need of the system that is stated on the specifications part. The result of the testing process shows that the specifications are satisfied and the cleaning result examination using XRF shows that the wafer cleaned using an automatic system is comparable to that from the manual process with a smaller amount of time.