DEVELOPMENT OF PRINTED CIRCUIT BOARD BASED ELECTROCHEMICAL BIOSENSOR POSTFABRICATION METHOD
Electrochemical biosensors are tools for testing the presence of analytes in samples. A common sensor fabrication technique is thick film fabrication such as screen printing. Apart from this fabrication technique, there is the development of thin film fabrication techniques using industrial proce...
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Format: | Final Project |
Language: | Indonesia |
Online Access: | https://digilib.itb.ac.id/gdl/view/80964 |
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Institution: | Institut Teknologi Bandung |
Language: | Indonesia |
Summary: | Electrochemical biosensors are tools for testing the presence of analytes in
samples. A common sensor fabrication technique is thick film fabrication such as
screen printing. Apart from this fabrication technique, there is the development of
thin film fabrication techniques using industrial processes on printed circuit board
(PCB) substrates. PCB-based fabrication techniques have several advantages with
fabrication precision and the potential for good integration capabilities with
electronic components. However, industrial processes can leave behind
contaminants and specifications that are not fully suited to the needs of sensor
applications. Thus, a sensor post-fabrication method is needed before sensor
applications.
In this final project, a post-fabrication method for sensors is developed on a PCB
substrate with a gold working electrode (WE) and a gold counter electrode (CE)
and a silver reference electrode (RE). There are various experiments to determine
the method of plating, cleaning, and forming the Ag/AgCl reference electrode. The
sensor goes through a plating process to re-coat the silver metal on the RE. The
plating method chosen was electroless immersion plating for 8 hours. The sensor
goes through a cleaning process to reduce contamination on the surface layer of
the sensor electrode. The cleaning method chosen was sonication for 5 minutes in
acetone and distilled water solution. The sensor also goes through a chlorination
process to form an Ag/AgCl layer on the RE. There are two variations of the
Ag/AgCl reference electrode formation method. Method evaluation was carried out
using SEM and EDX of the sensor surface. The measurement results were tested on
two analytes such as PB and K3[Fe(CN)6] with CV, LSV, and CA techniques. PCB
sensors showed better selectivity when compared with commercial sensors, based
on CV characteristics that are more similar to reference. PCB sensors also
exhibited a higher linearity value (R2 = 0,998). |
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