Damage progression in BGA solder joints during board-level drop test
This study examines the dynamic fracture propagation experienced by critical solder joints in a BGA test package during board-level single drop test. An Input-G loading method is employed to simulate a drop test condition with a peak acceleration of 1500G within a time duration of 0.5 ms. Unifie...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2011
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/39332/1/EPTC_Damage_Progression_in_BGA_Solder_Joints_during_Board-Level_Drop_Test.pdf http://irep.iium.edu.my/39332/ |
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| Institution: | Universiti Islam Antarabangsa Malaysia |
| Language: | English |