Damage progression in BGA solder joints during board-level drop test

• Main Authors: Yamin, A.F.M., Shaffiar, Norhashimah, Loh, W.K., Tamin, M.N.
• Format: Conference or Workshop Item
• Language: English
• Published: 2011
• Subjects: TA349 Mechanics of engineering. Applied mechanics
• Online Access: http://irep.iium.edu.my/39332/1/EPTC_Damage_Progression_in_BGA_Solder_Joints_during_Board-Level_Drop_Test.pdf; http://irep.iium.edu.my/39332/
• Institution: Universiti Islam Antarabangsa Malaysia

This study examines the dynamic fracture propagation experienced by critical solder joints in a BGA test package during board-level single drop test. An Input-G loading method is employed to simulate a drop test condition with a peak acceleration of 1500G within a time duration of 0.5 ms. Unifie...