Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf http://irep.iium.edu.my/39333/ |
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| Institution: | Universiti Islam Antarabangsa Malaysia |
| Language: | English |