Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

• Main Authors: Shaffiar, Norhashimah, Loh, W.K., Kamsah, N.
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: TA349 Mechanics of engineering. Applied mechanics
• Online Access: http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf; http://irep.iium.edu.my/39333/
• Institution: Universiti Islam Antarabangsa Malaysia

This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-...