Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

• Main Authors: Tay, S.L., Haseeb, A.S. Md. Abdul, Johan, M.R., Munroe, P.R., Quadir, M.Z.
• Format: Article
• Published: Elsevier 2013
• Subjects: TA Engineering (General). Civil engineering (General)
• Online Access: http://eprints.um.edu.my/11759/; http://www.sciencedirect.com/science/article/pii/S096697951200369X; http://dx.doi.org/10.1016/j.intermet.2012.09.016
• Institution: Universiti Malaya

This paper reports on the effects of adding Ni nanoparticles to a Sn–3.8Ag–0.7Cu solder. The nanocomposite was prepared by manual blending of SAC solder paste with various percentages of Ni particles. Results showed that the addition of Ni nanoparticles did not bring any significant change in the on...