Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen

Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen

The porous copper foam was sandwiched between two coppers plate and then brazed using copper-tin (9.7 %)-nickel (5.7 %)-phosphorus (7 %) filler foil. Brazing process was conducted to joint copper/porous copper foam by evaluating the effect of porous copper foam pore densities pore per inch (PPI)] an...

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Bibliographic Details
Main Authors: Mohd Zahri, N. A., Sahira Shafee, N. E., Yusof, F., Nurmaya Musa, S., Liana Sukiman, N., Haseeb, A. S. M. A., Miyashita, Y., Ariga, T.
Format: Article
Published: Wiley-VCH Verlag 2021
Subjects:
Q Science (General)
Online Access:http://eprints.um.edu.my/34019/
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Institution: Universiti Malaya

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http://eprints.um.edu.my/34019/

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