Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen

The porous copper foam was sandwiched between two coppers plate and then brazed using copper-tin (9.7 %)-nickel (5.7 %)-phosphorus (7 %) filler foil. Brazing process was conducted to joint copper/porous copper foam by evaluating the effect of porous copper foam pore densities pore per inch (PPI)] an...

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Main Authors: Mohd Zahri, N. A., Sahira Shafee, N. E., Yusof, F., Nurmaya Musa, S., Liana Sukiman, N., Haseeb, A. S. M. A., Miyashita, Y., Ariga, T.
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Published: Wiley-VCH Verlag 2021
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Online Access:http://eprints.um.edu.my/34019/
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spelling my.um.eprints.340192022-06-24T07:08:56Z http://eprints.um.edu.my/34019/ Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen Mohd Zahri, N. A. Sahira Shafee, N. E. Yusof, F. Nurmaya Musa, S. Liana Sukiman, N. Haseeb, A. S. M. A. Miyashita, Y. Ariga, T. Q Science (General) The porous copper foam was sandwiched between two coppers plate and then brazed using copper-tin (9.7 %)-nickel (5.7 %)-phosphorus (7 %) filler foil. Brazing process was conducted to joint copper/porous copper foam by evaluating the effect of porous copper foam pore densities pore per inch (PPI)] and brazing holding times. The brazed joint interface of copper and porous copper foam was characterised using Field emission scanning electron microscopy and Energy-dispersive x-ray spectroscopy for the microstructure and elemental composition analysis, respectively. X-ray diffraction analysis was carried out on the shear fractured surfaces of brazed copper and porous copper foam for phase determination. The results exhibited distinct phases of copper (Cu), copper phosphide (Cu3P), nickel phosphide (Ni3P), and copper compound with tin (6 : 5) (Cu6Sn5). The filler layer was formed as an island-shaped that consists of copper phosphide and nickel phosphide. Prolong brazing holding time causes a thinner filler layer in brazing seam. While the non-uniform thickness of the filler layer was observed at different pore densities of porous copper foam. The shear strength of brazed copper/porous copper foam 15 PPI with a 10 min brazing holding time yield a maximum shear strength of 2.9 MPa. Wiley-VCH Verlag 2021-06 Article PeerReviewed Mohd Zahri, N. A. and Sahira Shafee, N. E. and Yusof, F. and Nurmaya Musa, S. and Liana Sukiman, N. and Haseeb, A. S. M. A. and Miyashita, Y. and Ariga, T. (2021) Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen. Materialwissenschaft und Werkstofftechnik, 52 (6). pp. 655-663. ISSN 0933-5137, DOI https://doi.org/10.1002/mawe.202000059 <https://doi.org/10.1002/mawe.202000059>. 10.1002/mawe.202000059
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic Q Science (General)
spellingShingle Q Science (General)
Mohd Zahri, N. A.
Sahira Shafee, N. E.
Yusof, F.
Nurmaya Musa, S.
Liana Sukiman, N.
Haseeb, A. S. M. A.
Miyashita, Y.
Ariga, T.
Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen
description The porous copper foam was sandwiched between two coppers plate and then brazed using copper-tin (9.7 %)-nickel (5.7 %)-phosphorus (7 %) filler foil. Brazing process was conducted to joint copper/porous copper foam by evaluating the effect of porous copper foam pore densities pore per inch (PPI)] and brazing holding times. The brazed joint interface of copper and porous copper foam was characterised using Field emission scanning electron microscopy and Energy-dispersive x-ray spectroscopy for the microstructure and elemental composition analysis, respectively. X-ray diffraction analysis was carried out on the shear fractured surfaces of brazed copper and porous copper foam for phase determination. The results exhibited distinct phases of copper (Cu), copper phosphide (Cu3P), nickel phosphide (Ni3P), and copper compound with tin (6 : 5) (Cu6Sn5). The filler layer was formed as an island-shaped that consists of copper phosphide and nickel phosphide. Prolong brazing holding time causes a thinner filler layer in brazing seam. While the non-uniform thickness of the filler layer was observed at different pore densities of porous copper foam. The shear strength of brazed copper/porous copper foam 15 PPI with a 10 min brazing holding time yield a maximum shear strength of 2.9 MPa.
format Article
author Mohd Zahri, N. A.
Sahira Shafee, N. E.
Yusof, F.
Nurmaya Musa, S.
Liana Sukiman, N.
Haseeb, A. S. M. A.
Miyashita, Y.
Ariga, T.
author_facet Mohd Zahri, N. A.
Sahira Shafee, N. E.
Yusof, F.
Nurmaya Musa, S.
Liana Sukiman, N.
Haseeb, A. S. M. A.
Miyashita, Y.
Ariga, T.
author_sort Mohd Zahri, N. A.
title Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen
title_short Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen
title_full Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen
title_fullStr Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen
title_full_unstemmed Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen
title_sort interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeeinfluss von porendichte des kupferschaums und lothaltezeit auf das grenzflachengefuge und die festigkeit von kupfer-kupferschaum-lotverbindungen
publisher Wiley-VCH Verlag
publishDate 2021
url http://eprints.um.edu.my/34019/
_version_ 1738510701869137920