A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties

Face recognition is one of the most sophisticated disciplines of biometric systems. The use of VCSEL in automotive applications is one of the most recent advances. The existing VCSEL package with a diffuser on top of a lens intended for automotive applications could not satisfy the criteria of the a...

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Main Authors: Khairul, Mohd Arshad, Muhamad, Mat Noor, Asrulnizam, Abd Manaf, Kawarada, Hiroshi, Shaili Falina, Mohd Sukri, Mohd Nasyriq, Syamsul
Format: Article
Language:English
Published: MDPI 2022
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Online Access:http://umpir.ump.edu.my/id/eprint/40217/1/A%20comparative%20modelling%20study%20of%20new%20robust%20packaging%20technology.pdf
http://umpir.ump.edu.my/id/eprint/40217/
https://doi.org/10.3390/mi13091513
https://doi.org/10.3390/mi13091513
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Institution: Universiti Malaysia Pahang Al-Sultan Abdullah
Language: English
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spelling my.ump.umpir.402172024-02-09T01:55:12Z http://umpir.ump.edu.my/id/eprint/40217/ A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties Khairul, Mohd Arshad Muhamad, Mat Noor Asrulnizam, Abd Manaf Kawarada, Hiroshi Shaili Falina, Mohd Sukri Mohd Nasyriq, Syamsul T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Face recognition is one of the most sophisticated disciplines of biometric systems. The use of VCSEL in automotive applications is one of the most recent advances. The existing VCSEL package with a diffuser on top of a lens intended for automotive applications could not satisfy the criteria of the automotive TS16949: 2009 specification because the package was harmed and developed a lens fracture during 100 thermal cycle tests. In order to complete a cycle, the temperature rises from −40 °C to 150 °C and then rises again from 150 °C to 260 °C. The package then needs to be tested 500 times to ensure it fits the requirements without failing in terms of appearance or functionality. To this extent, the goal of this research is to develop packaging for 1 mm2 VCSEL chips with a diffuser on top that prevents fractures or damage to the package during heat cycle testing with multiple materials. The package was created using the applications SolidWorks 2017 and AutoCAD Mechanical 2017. The ANSYS Mechanical Structural FEA Analysis program simulated all packages for mechanical stress to guarantee that all packages generated were resilient to high temperature conditions. All packages exhibit no abnormalities and are robust for various temperatures ranging from low to high. Therefore, these packaged 1 mm2 VCSEL chips with a diffuser on top provide an effective approach for the application of VCSEL suitable in high temperature conditions. MDPI 2022-09 Article PeerReviewed pdf en cc_by_4 http://umpir.ump.edu.my/id/eprint/40217/1/A%20comparative%20modelling%20study%20of%20new%20robust%20packaging%20technology.pdf Khairul, Mohd Arshad and Muhamad, Mat Noor and Asrulnizam, Abd Manaf and Kawarada, Hiroshi and Shaili Falina, Mohd Sukri and Mohd Nasyriq, Syamsul (2022) A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties. Micromachines, 13 (1513). pp. 1-15. ISSN 2072-666X. (Published) https://doi.org/10.3390/mi13091513 https://doi.org/10.3390/mi13091513
institution Universiti Malaysia Pahang Al-Sultan Abdullah
building UMPSA Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang Al-Sultan Abdullah
content_source UMPSA Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic T Technology (General)
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
spellingShingle T Technology (General)
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
Khairul, Mohd Arshad
Muhamad, Mat Noor
Asrulnizam, Abd Manaf
Kawarada, Hiroshi
Shaili Falina, Mohd Sukri
Mohd Nasyriq, Syamsul
A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties
description Face recognition is one of the most sophisticated disciplines of biometric systems. The use of VCSEL in automotive applications is one of the most recent advances. The existing VCSEL package with a diffuser on top of a lens intended for automotive applications could not satisfy the criteria of the automotive TS16949: 2009 specification because the package was harmed and developed a lens fracture during 100 thermal cycle tests. In order to complete a cycle, the temperature rises from −40 °C to 150 °C and then rises again from 150 °C to 260 °C. The package then needs to be tested 500 times to ensure it fits the requirements without failing in terms of appearance or functionality. To this extent, the goal of this research is to develop packaging for 1 mm2 VCSEL chips with a diffuser on top that prevents fractures or damage to the package during heat cycle testing with multiple materials. The package was created using the applications SolidWorks 2017 and AutoCAD Mechanical 2017. The ANSYS Mechanical Structural FEA Analysis program simulated all packages for mechanical stress to guarantee that all packages generated were resilient to high temperature conditions. All packages exhibit no abnormalities and are robust for various temperatures ranging from low to high. Therefore, these packaged 1 mm2 VCSEL chips with a diffuser on top provide an effective approach for the application of VCSEL suitable in high temperature conditions.
format Article
author Khairul, Mohd Arshad
Muhamad, Mat Noor
Asrulnizam, Abd Manaf
Kawarada, Hiroshi
Shaili Falina, Mohd Sukri
Mohd Nasyriq, Syamsul
author_facet Khairul, Mohd Arshad
Muhamad, Mat Noor
Asrulnizam, Abd Manaf
Kawarada, Hiroshi
Shaili Falina, Mohd Sukri
Mohd Nasyriq, Syamsul
author_sort Khairul, Mohd Arshad
title A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties
title_short A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties
title_full A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties
title_fullStr A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties
title_full_unstemmed A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties
title_sort comparative modelling study of new robust packaging technology 1 mm2 vcsel packages and their mechanical stress properties
publisher MDPI
publishDate 2022
url http://umpir.ump.edu.my/id/eprint/40217/1/A%20comparative%20modelling%20study%20of%20new%20robust%20packaging%20technology.pdf
http://umpir.ump.edu.my/id/eprint/40217/
https://doi.org/10.3390/mi13091513
https://doi.org/10.3390/mi13091513
_version_ 1822924128173162496