A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties

• Main Authors: Khairul, Mohd Arshad, Muhamad, Mat Noor, Asrulnizam, Abd Manaf, Kawarada, Hiroshi, Shaili Falina, Mohd Sukri, Mohd Nasyriq, Syamsul
• Format: Article
• Language: English
• Published: MDPI 2022
• Subjects: T Technology (General); TA Engineering (General). Civil engineering (General); TJ Mechanical engineering and machinery; TL Motor vehicles. Aeronautics. Astronautics
• Online Access: http://umpir.ump.edu.my/id/eprint/40217/1/A%20comparative%20modelling%20study%20of%20new%20robust%20packaging%20technology.pdf; http://umpir.ump.edu.my/id/eprint/40217/; https://doi.org/10.3390/mi13091513; https://doi.org/10.3390/mi13091513
• Institution: Universiti Malaysia Pahang Al-Sultan Abdullah

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