Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
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Taylor & Francis
2010
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my.unimap-101782017-11-29T07:02:17Z Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive Ho, Li Ngee Tang, Fei Wu Nishikawa, Hiroshi Takemoto, Tadashi Aging Copper and alloy Electrical properties Phenolic Link to publisher's homepage at http://www.taylorandfrancisgroup.com/ In this study, a pre-alloyed Cu-P powder with a trace amount of P (0.002 at.%) was used as a metallic filler in a phenolic resin-based electrically conductive adhesive (ECA). The electrical property of the Cu-P-filled ECA was investigated for long-term stability and reliability by aging at high temperature exposure at 125°C and 85°C/85% RH for 1000 h, respectively. Results showed that the electrical resistivity of the Cu-P-filled ECA could be maintained consistently low after high temperature exposure at 125°C for 1000 h or aging at 85°C/85% RH for 1000 h, compared with the rapidly increased resistivity of Cu-filled ECA over time. A significantly low final resistivity at an order of magnitude of 10-4 Ω·cm could be maintained in Cu-P-filled ECA even after aging at 85°C/85% RH for 1000 h. 2010-11-10T08:48:45Z 2010-11-10T08:48:45Z 2010-08 Article Journal of Adhesion, vol. 86(8), August 2010, pages 805-813 0021-8464 http://www.informaworld.com/smpp/content~db=all~content=a925212335~frm=titlelink http://hdl.handle.net/123456789/10178 en Taylor & Francis |
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Aging Copper and alloy Electrical properties Phenolic |
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Aging Copper and alloy Electrical properties Phenolic Ho, Li Ngee Tang, Fei Wu Nishikawa, Hiroshi Takemoto, Tadashi Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive |
| description |
Link to publisher's homepage at http://www.taylorandfrancisgroup.com/ |
| format |
Article |
| author |
Ho, Li Ngee Tang, Fei Wu Nishikawa, Hiroshi Takemoto, Tadashi |
| author_facet |
Ho, Li Ngee Tang, Fei Wu Nishikawa, Hiroshi Takemoto, Tadashi |
| author_sort |
Ho, Li Ngee |
| title |
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive |
| title_short |
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive |
| title_full |
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive |
| title_fullStr |
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive |
| title_full_unstemmed |
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive |
| title_sort |
electrical properties of pre-alloyed cu-p containing electrically conductive adhesive |
| publisher |
Taylor & Francis |
| publishDate |
2010 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/10178 |
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1643802683205746688 |