Research development of solder materials and its intermetallic compound (IMC) study
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2014
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my.unimap-320332014-02-19T08:25:31Z Research development of solder materials and its intermetallic compound (IMC) study Mohd Arif Anuar, Mohd Salleh Najib S., Ibrahim Saud, N. Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad arifanuar@unimap.edu.my najib8789@gmail.com intanniza@yahoo.com Composite Intermetallic compound Lead-Free solder Solder fabrication Link to publisher's homepage at http://www.scientific.net/ Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic compounds will increase the brittleness of solder joints and detrimentally affects its mechanical properties. This paper reviews the latest fabrication method for solder materials and the literatures of bulk IMCs study in most solder materials by other researchers. Explanation on solder fabrication by using powder metallurgy method to produce solder materials and IMCs study were explained in detail in this paper. 2014-02-19T08:25:31Z 2014-02-19T08:25:31Z 2012-12 Article Mohd Arif Anuar Mohd Salleh et al., Advanced Materials Research, vol.626, 2012, pages 797-801 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32033 http://www.scientific.net/AMR.626.797 en Scientific.Net/Trans Tech Publications |
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English |
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Composite Intermetallic compound Lead-Free solder Solder fabrication |
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Composite Intermetallic compound Lead-Free solder Solder fabrication Mohd Arif Anuar, Mohd Salleh Najib S., Ibrahim Saud, N. Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad Research development of solder materials and its intermetallic compound (IMC) study |
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Link to publisher's homepage at http://www.scientific.net/ |
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arifanuar@unimap.edu.my |
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arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Najib S., Ibrahim Saud, N. Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Najib S., Ibrahim Saud, N. Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
Research development of solder materials and its intermetallic compound (IMC) study |
| title_short |
Research development of solder materials and its intermetallic compound (IMC) study |
| title_full |
Research development of solder materials and its intermetallic compound (IMC) study |
| title_fullStr |
Research development of solder materials and its intermetallic compound (IMC) study |
| title_full_unstemmed |
Research development of solder materials and its intermetallic compound (IMC) study |
| title_sort |
research development of solder materials and its intermetallic compound (imc) study |
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Scientific.Net/Trans Tech Publications |
| publishDate |
2014 |
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http://dspace.unimap.edu.my:80/dspace/handle/123456789/32033 |
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1643796745105178624 |