Wire bond shear test simulation on sharp groove surface bond pad
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Trans Tech Publications
2014
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my.unimap-326612014-03-13T04:12:15Z Wire bond shear test simulation on sharp groove surface bond pad Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Ahmad Husni, Mohd Shapri Vairavan, Rajendaran vc.sundress@gmail.com ANSYS Sharp groove surface Shear test Wire bond Link to publisher's homepage at http://www.ttp.net/ Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response. 2014-03-13T04:12:15Z 2014-03-13T04:12:15Z 2012-12 Article Advanced Materials Research, vol.262-623, 2012, pages 647-651 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32661 http://www.scientific.net/AMR.622-623.647 en Trans Tech Publications |
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Malaysia |
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Universiti Malaysia Perlis |
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English |
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ANSYS Sharp groove surface Shear test Wire bond |
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ANSYS Sharp groove surface Shear test Wire bond Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Ahmad Husni, Mohd Shapri Vairavan, Rajendaran Wire bond shear test simulation on sharp groove surface bond pad |
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Link to publisher's homepage at http://www.ttp.net/ |
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vc.sundress@gmail.com |
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vc.sundress@gmail.com Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Ahmad Husni, Mohd Shapri Vairavan, Rajendaran |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Ahmad Husni, Mohd Shapri Vairavan, Rajendaran |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
Wire bond shear test simulation on sharp groove surface bond pad |
| title_short |
Wire bond shear test simulation on sharp groove surface bond pad |
| title_full |
Wire bond shear test simulation on sharp groove surface bond pad |
| title_fullStr |
Wire bond shear test simulation on sharp groove surface bond pad |
| title_full_unstemmed |
Wire bond shear test simulation on sharp groove surface bond pad |
| title_sort |
wire bond shear test simulation on sharp groove surface bond pad |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/32661 |
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1643796945500635136 |