Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

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Bibliographic Details
Main Authors: Chong, Leong Gan, Classe, Francis, Uda, Hashim, Prof. Dr.
Other Authors: uda@unimap.edu.my
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
Apparent activation energy (Eaa)
BGA package
High temperature storage life
Lognormal plot
Long-term reliability
Reliability management
Storage
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33078
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://www.emeraldinsight.com/

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